Strain Gauge Installations with M-Bond 600 Adhesive (Stress Analysis and Transducer Applications).

Strain Gage Adhesive for Stress Analysis and Transducer Applications.

Purchase strain gauges, accessories and application kits online.

No single manufacturing step in transducer production has more influence on the performance and longevity of a transducer than foil strain gage bonding. Paramount to this process is the selection of an appropriate adhesive. Improper selection or application of an adhesive will assuredly degrade transducer performance, regardless of the quality of strain gage or spring element used.

Similar to M-Bond 610 except with more reactive curing agent. Shorter shelf life, pot life, and working time than M-Bond 610, but has lower temperature cures and faster Strain Gage Adhesive reaction time. Cure must begin within 30 minutes of application (up to 4 hours for M-Bond 610).

Micro-Measurements offers online three specially formulated epoxy (and epoxy-phenolic) adhesives for use in high-precision transducers M-Bond 610, 600, and 43-B. These adhesives are designed for higher operating temperatures and thinner bond lines than the AE-10/15 system. They typically contain about 75% volatile solvents which must be liberated during specified air-dry periods and subsequent elevated-temperature curing cycles. The large solvent content allows the formation of extremely thin, hard and void-free bond lines, and greatly increases the pot life after mixing. The cement thicknesses under properly bonded gages are only about 0.0002 in (0.005 mm) with these adhesives. Obtaining such thin bond lines requires, however, strict adherence to recommended bonding procedures. Particularly important are the cure temperature ( along with its rise time and duration), the clamping pressure, and the post-cure.

Strain Gauge Installations with M-Bond 610 Adhesive (Stress Analysis and Transducer Applications):

OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION:

• CSM Degreaser or GC-6 Isopropyl Alcohol
• Silicon-Carbide Paper
• M-Prep Conditioner A
• M-Prep Neutralizer 5A
• GSP-1 Gauze Sponges
• CSP-1 Cotton Tip Applicators
• MJG-2 Mylar® Tape
• TFE-1 Teflon® Film
• HSC Spring Clamp
• GT-14 Pressure Pads and Backup Plates

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El M-bond 600 es similar al M-Bond 610 excepto que con un agente de curado más reactivo, menor vida útil y de duración de la mezcla que el 610. Requiere menor temperatura de curado y un tiempo de reacción del pegado más rápido.