Strain Gauge Installations with M-Bond 610 Adhesive (Stress Analysis and Transducer Applications)

Strain Gage Adhesive for Stress Analysis and Transducer Applications.

Purchase strain gauges, accessories and application kits online.

Used primarily in stress analysis applications over a wide temperature range, and in precision transducers. Elevated temperature curing.
Two-component, solvent-thinned, epoxy-phenolic adhesive for high-performance applications, including high-precision transducers. Solids content 22%. Widest temperature range general-purpose adhesive available.
Strain Gage Adhesive for Stress Analysis and Transducer Applications Low viscosity, capable of gluelines less than 0.0002 in (0.005 mm). Extremely thin, hard, void-free gluelines minimize creep, hysteresis, and linearity problems. Cure must begin within four hours of application.

OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION:
• CSM Degreaser or GC-6 Isopropyl Alcohol
• Silicon-Carbide Paper
• M-Prep Conditioner A
• M-Prep Neutralizer 5A
• GSP-1 Gauze Sponges
• CSP-1 Cotton Tip Applicators
• MJG-2 Mylar® Tape
• TFE-1 Teflon® Film
• HSC Spring Clamp
• GT-14 Pressure Pads and Backup Plates