Advanced Sensors Technology Strain Gage Installation with M-Bond 600 Adhesive.

Advanced Sensors Technology applies tangible specification and manufacturing process improvements, along with industry-exclusive strain gage sensor design techniques, for direct customer benefit. The innovation behind Advanced Sensors Technology reflects many decades of Micro-Measurements R&D experience, gained across a global portfolio of thousands of successful applications, with other refinements achieved via ongoing customer feedback.

Strain gage (strain gauge) technology, as a key internal component of finished sensor designs, is a long-recognized industry standard. The strain gages are used to detect a change in electrical resistance, occurring in response to an applied force. In addition to their reliability, strain gages are relatively compact and low cost. This has facilitated their widespread adoption into many of today’s force, load, position, pressure, tension, weight, and strain sensor designs. Such traditional designs have typically called for the bonding and soldering of anywhere from one to four individual strain gages within a single proprietary configuration. Among these, the full Wheatstone bridge, a four-strain-gage arrangement, has consistently offered the highest measurement accuracy, sensitivity and extraneous temperature cancellation.

Micro-Measurements M-Bond 600 adhesive is high-performance epoxy resins, formulated specifically for bonding Advanced Sensors Technology strain gages and special-purpose sensors. When properly cured, these adhesives are useful for temperatures ranging from -452° to +700°F [+370°C] for short periods with M-Bond 600 and 610. In common with other organic materials, life is limited by oxidation and sublimation effects at elevated temperatures. For proper results, the procedures and techniques presented in this video should be used with qualified Micro-Measurements installation accessories used in this procedure:
• CSM Degreaser or GC-6 Isopropyl Alcohol
• Silicon-Carbide Paper
• M-Prep Conditioner A
• M-Prep Neutralizer 5A
• GSP-1 Gauze Sponges
• CSP-1 Cotton Applicators
• MJG-2 Mylar® Tape
• TFE-1 Teflon® Film
• HSC-X Spring Clamp
• GT-14 Pressure Pads and Backup Plates

Further design improvements over traditional strain gage types include smaller and tighter grid-resistance tolerances, improved gage-to-gage repeatability, and enhanced measurement stability. All enhancements are implemented via a fully optimized fabrication process, incorporating the very latest in tooling, methods, and equipment. As a result, the prototype design and manufacturing of anywhere from a single strain gage piece up to OEM volumes may be easily accommodated, with uniform high quality and competitive lead times.

[vaibhav]

upto what strain rate or what frequency this adhesive will work ???

[anabravo]

El adhesivo M-Bond 600 de Micro-Measurements es una resina epoxy de alto rendimiento, formulada específicamente para el pegado tanto de bandas extensométricas de Tecnología Advanced Sensors, como de sensores para aplicaciones especiales. Cuando se curan correctamente, estos adhesivos son útiles para temperaturas que van desde -269° a +370°C. El rango superior (+370ºC) es operativo tanto en el M-Bond 600 como en el M-Bond 610, durante cortos períodos.

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