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Top Intel Inventor on the Future of Advanced Packaging
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In his 16 years at Intel, Gang Duan has amassed nearly 500 patent applications to help push the envelope of how silicon dies are combined in packages and work to introduce glass substrates. For his unrelenting innovation, Duan earned Intel’s Inventor of the Year award for 2024.
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Intel Newsroom brings you the latest news and updates on world-changing technology that enriches the lives of everyone on Earth. Catch up on the latest innovations in client computing, artificial intelligence, security, data centers, international news and more. Watch recaps and replays from industry events where Intel has a major role, such as Mobile World Congress (MWC), Intel Innovation, the Consumer Electronics Show (CES) and others.
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About Intel Newsroom
Intel Newsroom brings you the latest news and updates on world-changing technology that enriches the lives of everyone on Earth. Catch up on the latest innovations in client computing, artificial intelligence, security, data centers, international news and more. Watch recaps and replays from industry events where Intel has a major role, such as Mobile World Congress (MWC), Intel Innovation, the Consumer Electronics Show (CES) and others.
Connect with Intel Newsroom
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