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Common design challenges with advanced semiconductor packaging
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Learn about common design challenges when creating advanced semiconductor packaging. By watching the video, you will learn about different design solutions for physical design and verification of advanced semiconductor packages and 2.5 heterogenous assemblies. xPD supports all substrate types including silicon interposers with industry leading capacity and performance.
▶️ Connect with us:
#Semiconductor #ElectricalEngineering #Engineering #ICdesign
▶️ Connect with us:
#Semiconductor #ElectricalEngineering #Engineering #ICdesign
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