How Packaging Could Be Intel's Secret Sauce

Adam talked with Wendell from @Level1Techs at Intel Innovation 2023 about how packaging could be the companies secret to success and how it's going to play a big part in the future.

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00:00 - Innovation For Developers
01:02 - Packaging Technologies
03:10 - All In On Packaging
06:35 - Packaging Cost
07:13 - Pushing Compute
08:07 - Downsides Of This Strategy
09:02 - Open Questions
10:07 - CXL 3.0

[thetrivialone]

Adam has started to get really good at interviewing people. Like looking at this interview versus some of his earlier interviews. This is really great!

[unclerubo]

I wish I could feel excited about anything as much as Wendell is about new tech :')

[__aceofspades]

Packaging is the future of CPUs and GPUs. There is only so much you can do with node shrinks and how fast you can transition to compelling nodes. Look at how TSMC has now stumbled with 3nm, it was delayed and now we see the A17 pro with it, and its a disappointing node. Packaging doesnt solve node issues, but it allows far more flexibility, cost savings, specialization, etc. Intel has done a great job in positioning themself for the future.

[TokenTech]

Wendell is like a kid on Christmas morning! I love it! I have no idea what he is talking about but damn it sounds cool!

[DeltaSierra]

Intel's new packaging is one of the few things they have going for them. Also interesting that packaging and tiles is how they want to be known for breaking into what has historically been called chiplets. It makes sense in that every brand tries to forge it's own identity and marketing approach. Ultimately though, how successful it is will depends on Intel's execution, not marketing and academics. As Wendell said, it it's a bit tricky to ensure everything works well together and performance continues to scale, i.e. it's not just a given.

[FrenziedManbeast]

Wendell operates several tiers above many people and it comes through so well on YouTube. He's got the long-game view for silicon to understand implications for the industry from these press releases where I'll be glazed over wondering how this could ever benefit me. I've been watching his stuff off and on for years and he's right more often than wrong. He's part journalist, part nuclear physicist!

[Mervinion]

Intel is supposedly investing in packaging facility in Poland. People are thinking that it would be just putting products fabricated in Germany into boxes. I try to explain them that "Packaging" means something more when dealing with silicon. Packaging facilities can be as much advanced as fabrication and are more important than ever.

[costafilh]

BIG packages are definitely the future!

[RayanMADAO]

Cxl sounds really interesting, almost revolutionizes modern computer architecture

[divyjotsingh]

I have never thought way about interposers. They're added cost to save costs. I'm dum and wendells a genius

[mikebruzzone]

I've been covering this since Intel wanted to start selling TSMC package services in Arizona 2 years ago where have you been Adam and Wendell? mb

[doxydoxdelamanca]

The expanse offered insight into the future = all-glass phones.

[EinSwitzer]

Products that makes it intact to the purchaser as well as looking cool on a shelf or In backdrop.

[zodwraith]

Holy shit I never realized how tall Adam is. I know Wendell is a big boy but damn I never thought APM would be even taller. Friend of the show wants to know how tall are you really Adam? Does the mere sight of you make Asians run in fear?

[tomstech]

It's so entertaining hearing people excited about AMD's previous technologies.
"OMG they can mix different generations of chiplets and IO dies"
"the cost to produce each chiplet is reduced"
"they can bin just the cores for server and the higher power draw dies to go desktop, they don't have to bin a whole monolithic chip"
It's like watching a Adored video from 2018, You wait Intel will make GPU's and 3D vcache chips next ;)

[tomstech]

5:30 a bit like AMD resuing IO dies with newer generations of Ryzen (3000-5000, and 7000-)
Intels looking at all the benefits and posibilities AMD has been doing for the last few years.

[fredsorre]

It's funny how things changed in just a few years oh how Intels comments that AMD's gluing their chips together didn't age well especially now that they are gonna be using a similar type of technology for their future processors .

[scarlet]

'Developers. Developers. Developers' Woohoo!

[LemmingOverlord]

Intel's been banging on about packaging and interconnects for God knows how long. They just kept missing targets or failing to secure customers. They were also their own worst customer...

[kingofstrike]

did he just avoided the question on glass can break ?