[Eng Sub] Intel Foveros

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1. Foveros ?
2. Structure
: Active interposer, Micro bump, TSV, Package on Package
: Top compute die
: Bottom base die
3. Variant
: Foveros Omni
: Foveros Direct
4. Applications
: Samsung Galaxy Book S laptop
: Aurora Supercomputer
: Intel Meteor Lake PC
  1. Semicon Talk
  2. IC Packaging
  3. Semiconductor Packaging
  4. Semiconductor
  5. yt:cc=on
  6. Intel
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[Eng Sub] Intel Foveros

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[Eng Sub] Intel 0:05:46

[Eng Sub] Intel EMIB

1 Packaging Process 1:00:35

1 Packaging Process Technology TSMC and Intel, CoWoS, EMIB, Foveros and Chiplets

[Eng Sub] How 0:05:39

[Eng Sub] How to gather information

[Eng Sub] Passive 0:04:11

[Eng Sub] Passive Components

Intel Previews New 0:01:49

Intel Previews New Hybrid CPU Architecture with Foveros 3D Packaging

Intel Leads the 0:03:42

Intel Leads the Way with Advanced Packaging

[Eng Sub] Substrate 0:05:54

[Eng Sub] Substrate - Flipchip Substrate Manufacturing Process, Core, Build-up, ABF

Modular Design at 0:00:54

Modular Design at Intel

[Eng Sub] Stealth 0:04:30

[Eng Sub] Stealth Dicing

Ponte Vecchio GPU 0:01:30

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The World of 0:01:11

The World of Advanced Packaging

Intel: We're Replacing 0:08:04

Intel: We're Replacing PCBs with Glass Core

[Eng Sub] Chiplet 0:05:33

[Eng Sub] Chiplet

[Eng Sub] 2.5D 0:06:11

[Eng Sub] 2.5D Package Technology: GPU+HBM, AMD, nVIDIA, TSMC

[Eng Sub] Marking 0:05:02

[Eng Sub] Marking Process: Laser marking, Ink marking, Nd-YAG laser, Green laser

[Eng Sub] 5G 0:05:15

[Eng Sub] 5G Smartphone: Samsung Galaxy, Apple iPhone, Qualcomm

Introducing Foveros the 0:00:20

Introducing Foveros the industry’s first 3D stacking of logic chips paving

Co-EMIB, Intel’s EMIB 0:01:17

Co-EMIB, Intel’s EMIB and Foveros Tech Together, Delivers High Bandwidth at Low Power

Комментарии
Автор

Brilliant presentation and excellent summary. This clarifies lot of confusion around Foveros and its variants. Keep up the awesome work.

nandishmehta
Автор

I can’t believe how detailed and up to date. Is this information. Thank you so much for your time and effort. 🙏🙏

yisehakg
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Foveros direct is seems to SoIC which is chip to chip Cu connect directly.
So Foveros Omni is also including 36um pitch ubump ?

jugen
Автор

How does their new Power Via technology fit in to packaging?

ruchida
Автор

Thank you. How does cu to cu bonding is achieved?

testuser