Numerical modelling of a microchip in ABAQUS | Part 1

This video shows how to do numerical modelling of a microchip design called the flip chip package in ABAQUS. This first part of the video introduces the theory behind the modelling principles and the next video (part 2) shows how to undertake the modelling directly in ABAQUS. A flip chip package is part of the microchip component in power electronic devices and it is excellently design to achieve high heat management. In this video, the silicon chip, polymeric STIM layer and copper heat-spreader components were considered. To reflect reality, the STIM layer was assumed to be voided (as this is normal due to the nature of the reflow process that is used to create such microchips).

Time stamps
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You can quickly navigate through the videos using these chapters.

00:00 - Intro
00:51 - Video outline
01:15 - Reference publication
01:24 - Intro to Flip Chip Technology
01:29 - Wire bonding technology
02:22 - Flip Chip Technology
04:09 - About CM Videos Insider Group
04:30 - Flip chip technology and heat sinks
05:40 - Solder thermal interface layer
06:33 - Sub-model of flip chip technology considered here
07:11 - Voiding in flip chip technology
07:37 - Question for the day
08:00 - Dimensions of components of the flip chip
08:13 - Virtual domain for the flip chip study
08:25 - Material properties for the flip chip study
08:31 - Case study investigated
09:06 - Quantifying thermal resistance of flip chips
09:48 - See Part 2 of video and Outro

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[khaledcine]

Thanks Dr Michae for the video we wait for your next part, please I have a question, how to excract mesh line then using struts replace mesh to generate a porous structure in Abaqus?