What is BGA Package? | PCB Knowledge

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BGA is short for Ball Grid Array. It changes the original J-leads on a dual in-line package or gull-wing leads on the flat package to solder balls, which are arranged in a grid like pattern on the undersurface of the package to increase the area used for the connections rather than just the periphery. In this way, the lead spacing can be evacuated and the number of leads can be increased.

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What is the Mold resin made of?
Thank you for making this video!🙏🏆

BullProspecting
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Interesting and good info, but the presentation is bizarre.

theftking
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Ok, BGA is compact, but why not LGA?=) It's too small and less chance to heat-damaging of a crystall, especially when it needs to repair\reball!

LasLexus
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