Your BGA and You | PCB Layout

If you're new to PCB Design, the concept of a BGA (or Ball Grid Array) may seem a little overly complicated. But, understanding BGAs helps open the door to mounting a lot of components in a single package. Tech Consultant Zach Peterson lays out everything you need to know to get started with BGAs.

0:00 Intro
1:12 What is a BGA?
2:30 Routing Traces into the Components
4:30 Constructing the Pads
5:58 Routing into the BGA
13:51 An Example BGA

Design guide for BGA fanout and routing:

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[asmi]

One point you might want to cover is that chip manufacturers often allow violating impedance specs in the fanout area because there is simply not enough space for full-spec traces and spacing. It would be great if you make a video explaining how to create DRC rules which apply only to a certain portion of the PCB (like fanout regions of BGAs). I had to figure it out myself back in the day, but I'm certain many people will find it useful.

[levirakes]

Your videos are edited with great clarity. Thank you for being so concise.

[zhangshunlu]

Great video! The pattern of your shirt looks like the BGA footprint 😆

[carlos_andre_becker]

Best classes I ever had!!! Congratultions!!! Zach. Very clear voice and rithm. Videos are full with very usefull information!

[montvydasklumbys]

5:30 I believe what you have described is an NSMD (Non solder mask defined) rather than SMD (Solder mask defined) pad. On SMD the solder mask goes on top of the pad and thus defines where the ball can stick. On contrary, with NSMD, solder mask is wider than the pad and thus the ball sticks to the whole pad. Note they are also called collapsing and non-collapsing pads.

[aravind]

Thanks Zach! Waiting for your next video to learn more about BGA fanout techniques.

[nawafaldabashi]

Thanks Zach! Enjoyed your Webinar yesterday, thanks for that as well :)

[mylon]

Can you make a video on best practices for creating the BGA schematic component, i.e., how to choose how many gates you would create and how to use them in a schematic?

[DiegoColl]

Good...!! this is a very interesting topic. Thank you so much!!

[xenofontzaras]

You are describing on about 5.10 the Soldermask defined pad. And it looks like the soldermask opening is bigger than the pad.

But I think, this is exactly the opposite, this should be smaller, not bigger
Can you clarify this please

[zuzannakalac]

Does anyone know where I can find footprint or pin diagram for i7-5500u cpu?

[優さん-nm]

You are showing a large BGA component @16:00, why not use smaller tracks and vias?

[varatharaj]

please explain, f(w/h) with example. for select no of layers when choosing the BGA.

[sparklee]

any video talked about via in pad fan out for BGA?

[TnInventor]

hello thanks fot the video, where can i find the BGA design guide video that you talked about comming soon ?

[優さん-nm]

Since designs run at several 100s of MHz today, won't all PCB tracks or most, need impedance control and length matching?

[akashgz]

I am New to This I want to design a 289 pin BGA before I work on 4 layers only. Any suggestions I had a licence of Altium designer. what to refer for BGA design and If BGA ic is not present Then Is any video that suggested create custom Library for BGA package.

[waleedarshad]

So, I do have a couple of questions. First is related to the device soldering. In a direct dock board, the device gets directly soldered onto the PCB but what happens when you use a socket, like in the FT boards? Do the packages still have the solder balls on them? or there is some other way the connection is made?

Secondly, most fabricators are fine with via in pads even for coarse pitch devices, so why not use it with all BGAs regardless of the pitch? Also, since you are adding a trace with a via, won't it add inductance to the power planes?

[jimjjewett]

With all those grouped ground pins, why not just connect them with a mini-plane? If the problem is that is makes soldering unreliable, why not at least cross-connect them? (Essentially a ground plane with the thermal relief around the pins.)

[優さん-nm]

Is invention of high pitch BGAs really necessary and worth it?