Inside the Intel 4 Process and Foveros Packaging for Meteor Lake | Talking Tech | Intel Technology

Intel Core Ultra processors represent our largest shift in client architecture in 40 years, and much of the magic is in how they’re made. We took Talking Tech to Malaysia to learn more about the Intel 4 process and Foveros packaging technologies used to manufacture Meteor Lake at scale. Hear from Bill Grimm, VP and Director of Product Engineering for Logic & Technology Development; Pat Stover, Senior Director of Technology Development; and Mei Fong Wong, Manager of our Penang Packaging Factory, as they dive into the details of how we fabricate the compute tile and bring it together with other elements of the disaggregated architecture.

0:00 - Introduction
0:18 - 4 Process nodes in 5 years
0:42 - Intel 4 process node improvements
3:36 - Brief peek at Intel 3 process node
4:03 - What is Foveros Technology
4:29 - Foveros on Meteor Lake
5:45 - How Meteor Lake is assembled
6:24 - Meteor Lake at Packaging Facility
7:24 - Packaging testing
8:01 - Wafer assembly
9:43 - Package assembly, test and finish

Talking Tech goes in depth on Meteor Lake with Intel architects and engineers:

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[KirkWheeler-po]

As an intel R&D engineer, i was excited to develop the first extremely fast Die to Wafer (Thermal Compression Bonding) attach process Pat Stover was talking about. A great team to work with to make unbelievably complex ideas a reality.

[__aceofspades]

Intel is more exciting now than they have been in the last decade. New nodes every year, Foveros (tiles), new architectures (P-core, E-core, GPU), NPUs (AI accelerators), new design philosophies, you name. Intel is doing so much right now. I am hoping I am able to pickup a new Meteor Lake laptop for Christmas!

[EnochGitongaKimathi]

I'm glad to see Intel working hard to regain manufacturing leadership. I appreciate how complex and difficult it is to keep innovating and moving technology forward. Glad to see Intel on EUV, can't wait for High-NA.

[matthewhayes]

Thank you to Alex and the entire production team for bringing us this amazing content. We love you!

[runninginthes]

I have very high optimism with Pat Gelsinger as leader, so far Intel has been solid since Alder Lake launched, even Pat able to makes Intel selling decent GPU too for budget gamer, honestly what Intel is really lacking right now is advertisement, you guys need to show your ads again on TV just like in old days when Core 2 family CPU launched or when Intel Core i first comes out, so more people will know how great your CPU and GPU !

[ai]

Love this kind of content, awesome to see some of the details behind the new processes!

[cwbh]

This isn't a flashy video and thats awesome because it shows there is some really real cool tech coming out. So excited to see how Intel changes and grows this decade!

[kubilayakaslan]

Energy efficient, AI capable and also place saver. 4 in 1, It is like an instant coffee. An oven, a fridge or a car equipment, something that needs this sort of chips will want to use these new design eagerly.

[j_official]

Thank you for bringing this to us. I really appreciate giving us insight into the world of chiplet hvm. Good luck with meteor lake and the future lakes, we are rooting for you to come back. 14 -> 10nm was a challenge but we look forward to Intel 3, 20A, 18A and beyond. And we look forward to thunderbolt 5 as well. Would love to see more of these videos. Especially when 20A is in HVM. Good luck!

[velo]

really hope you guys can compete in power efficiency.

[RichWithTech]

It really is starting to feel like intel is back on top

[ericreinhart]

Im rooting for you Intel. Take back your throne.

[Erik-rphi]

I'm just an enthusiast and have been following this stacking of chips to a base chip. What I don't yet understand is how the top chips have the wire paths through the silicon wafer to connect to the base chip. Bored through holes?

[netbat]

meteor lake is power efficent. waiting high performance intel 4 node cpu when 7ghz cpu possible, intel is the only company sell cpu have highhest frequency on the world

[bits]

Intel 3 sound like to me more like a node variant more like a new separate node, sth like N3P, N3B, N3X from TSMC for example...
P.S.: I know nothing about that process in detail, it's just how it seems to me.. But I love those kind of videos, makes you know the brand and products better

[HuntaKiller]

The igpu is on par with 780m
Quite good but i expected more
Come on u gaisss

[LeicaM]

So Intel is having 1.8 nm today! Directly by TSMC? Where and when to buy? What did Apple get then?

[Gilga]

i guess this is the reason they have nothing to fight zen 5 for most of 2024

[tarikzakzouk]

Somehow they remind me with the soviet union. Their mentality is still stuck at 10 nanometer.

[ouulriyac]

Very sad to see a company with such legacy messing up node decisions, hope to see them back with node leadership parity sometime in the future 😞