Most common Tablet defects , PROCESS and FORMULATION RELATED CAUSES

main tablet defects that can occur during the coating stage and best way to resolve them

When it comes to the manufacturing of tablets, the coating process plays a critical role in ensuring product quality and effectiveness. However, defects during the coating stage can lead to serious issues, impacting both functionality and appearance.

In today’s video, we’ll explore common coating defects and how to resolve them, starting with blistering.

1: Blistering
Blistering is caused by trapped moisture or volatile substances within the tablet core, often due to improper drying.

2: Chipping
Next is chipping, a defect caused by mechanical stress or improper handling during or after the coating process.

3: Cratering
Cratering occurs when the spray rate is too high, causing the coating solution to erode the tablet’s surface.

4: Sticking or Picking
Sticking or picking occurs when the coating is too wet, causing tablets to stick to each other or to the coating pan.

5: Pitting
Pitting, another common defect, results from inadequate tablet core formulation or overheating during the drying phase.

6: Blooming
Blooming is caused by the migration of plasticizers to the tablet surface, typically due to aging.
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