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SMT inspection and repair
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Good SMT patch processing solder joints and appearance should meet the following points
1. The surface of the solder joints should be complete, smooth and bright, without unevenness;
2. The wetting angle of the solder and the surface of the pad should be below 300 and not more than 600.
3. The height of the component should be moderate, and the solder should completely cover the part where the pad and the lead are soldered
After SMT patch processing, PCB board inspection
1. Are there any missing components,
2. Whether the components are pasted incorrectly,
3. Will it cause a short circuit?
4. Whether the component is soldered or not firmly
Visual inspection of solder joints, automatic optical inspection
1. The surface of the solder joints should be complete, smooth and bright, without unevenness;
2. The wetting angle of the solder and the surface of the pad should be below 300 and not more than 600.
3. The height of the component should be moderate, and the solder should completely cover the part where the pad and the lead are soldered
After SMT patch processing, PCB board inspection
1. Are there any missing components,
2. Whether the components are pasted incorrectly,
3. Will it cause a short circuit?
4. Whether the component is soldered or not firmly
Visual inspection of solder joints, automatic optical inspection
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