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Multi-disciplinary Simulation for 2.5/3D IC Co-Design
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MEPTEC IMAPS Semiconductor Industry Speaker Series
"Multi-disciplinary Simulation for 2.5/3D IC Co-Design"
Sooyong Kim, Sr Product Manager for 3DIC CPS Multiphysics, ANSYS
recorded May 20, 2020
"Multi-disciplinary Simulation for 2.5/3D IC Co-Design"
Sooyong Kim, Sr Product Manager for 3DIC CPS Multiphysics, ANSYS
recorded May 20, 2020
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