3D IC Podcast | 3D IC Physical Design Workflow

preview_player
Показать описание
One challenge teams face when designing 3D IC chips is managing data in different formats from difference sources. Teams need solutions that enable them to verify different components such as the interposer, the package and the die together. This episode of the Siemens 3D IC | The Future of semiconductor design podcast discusses what a 3D IC physical design workflow might look like, the challenges associated with 3D IC physical design and how a Siemens solution enables design teams to use data received in multiple, diverse formats.

About Siemens 3D IC Design Flow: a comprehensive set of tools and workflows targeted to develop advanced 2.5 and 3D IC heterogeneous system-in-package (SIP) designs.

#chiplets #semiconductor #icpackaging #advancedpackaging #3DICdesign #3dic #eda

FOLLOW US:
  1. Siemens Software
  2. 3D IC
  3. 3D IC Podcast
  4. EDA 3D IC
  5. Siemens 3D IC
  6. Siemens EDA
Рекомендации по теме
3D IC Podcast 0:27:18

3D IC Podcast | Getting Started with 3D IC

3D IC Podcast 0:22:04

3D IC Podcast | 3D IC Front-End Design

3D IC Podcast 0:21:59

3D IC Podcast | An introduction to 3D IC

3D IC Podcast 0:20:06

3D IC Podcast | 3D IC Physical Design Workflow

3D IC Podcast 0:14:27

3D IC Podcast | 3D IC Architecture & Design Flows

3D IC Podcast 0:17:04

3D IC Podcast | 3D IC is Here—But Is Your Architecture Ready for It? - Podcast Ep. 10

3D IC Podcast 0:21:10

3D IC Podcast | 3D IC Integration Challenges

3D IC Podcast 0:12:45

3D IC Podcast | Current State of 3D IC Design

3D IC Podcast 0:12:47

3D IC Podcast | 5 Game-changing 3D IC trends transforming semiconductors - Podcast Ep. 9

3D IC Podcast 0:21:08

3D IC Podcast | Uncovering 2.5D and 3D IC Tests

3D IC Market 0:00:36

3D IC Market Features, Opportunities and Challenges

Siemens heterogeneous 3D 0:02:14

Siemens heterogeneous 3D IC semiconductor design solution | 3D IC Overview Video

The Future of 0:23:37

The Future of 3D IC Design and the Discovery of Self-Replicating Living Robots

2.5D and 3DIC 0:56:27

2.5D and 3DIC Technology and Design, Tutorial, Paul Franzon, NC State University

Optimizing Hi-Rel Electronics 0:11:05

Optimizing Hi-Rel Electronics Design 2.5 3D Heterogeneous Integration & Advanced Interconnect.

Ludo Deferm, imec, 0:03:00

Ludo Deferm, imec, discusses the progress of 3D IC integrati

The World of 0:01:11

The World of Advanced Packaging

Automation and the 0:13:58

Automation and the Future of IC Design for Test

Reality Of Pahalgam 0:46:00

Reality Of Pahalgam Terr*r Atta*k

This pathological design 0:00:14

This pathological design feature can ruin your day | #pcbdesign #pcb #electronics

Reduce SWaP with 0:09:39

Reduce SWaP with Multi-physics Aware 3D Heterogeneous Package Design | Synopsys

Join Kewal Dhariwal 0:00:31

Join Kewal Dhariwal as he leads session: 'Transforming Enterprise Systems with 3D Integration a...

This is why 0:00:27

This is why hydrogen cars are not the future❗️ #shorts

Tackling Challenges in 0:55:00

Tackling Challenges in 3DHI Microelectronics for Aerospace, Government, and Defense

join shbcf.ru