The End of Moore’s Law? High Performance ICs Through Modular Chip Design

By Tom Smelker, VP & General Manager, Mercury Systems

Balancing the need for commercial silicon innovation for the digital-modernization effort with the need for a trusted and secure supply chain, the DoD struggles to quickly and cost-effectively deploy next-generation sensor processing systems. For the first time, with 2.5D heterogeneous integration of advanced silicon and chiplet technology, open system architecture at chipscale can deliver trusted, high-density RF, digital, and mixed-signal devices to the computing edge of key mission areas such as radar; intelligence, surveillance, and reconnaissance (ISR); weapons; and satellite communications. Tom provides an overview of chiplet technology and how it can be adapted for aerospace and defense applications.