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Copper dendritic growth by electrodeposition
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Two-dimensional growth of a copper dendritic pattern by electrodeposition at 8 V in a circular cell geometry using 1 M copper sulphate solution.
The original clip is 25 times slower.
Experiment performed at the Materials Electrochemistry Group (MEG) facilities.
The original clip is 25 times slower.
Experiment performed at the Materials Electrochemistry Group (MEG) facilities.
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