A Deep Dive Into PHY Architectures for Gen-Z Memory Fabrics | Gen-Z Webinar

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Hear from Gen-Z Consortium PHY Workgroup representatives as they provide a technical overview of Gen-Z's Physical Layer specification. This webinar was presented on Mar. 25, 2020. Participants in this presentation are:
-James Regan - Gen-Z PHY Workgroup Co-Chair and HPE Interconnect Expert
-Dr. Karl Bois - HPE Lead Signal Integrity and System Interconnect Engineer
-Tim Symons - Associate Technical Fellow at Microchip Technology
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good stuff guys, hope you go far! valuable info here. just some constructive criticism for a sec, raise the bitrate on that audio! haha

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