Stacking Dies on Glass Panels

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[Cs]

"we can already make perfect silicon substrates, and the cost and manufacturing ability is practically unbelievable, but what if we could make it even cheaper by switching to literal sand?"

[TardMan]

These videos are always so unbelievably well done, especially considering how often you crank these out. The work is much appreciated, I can always count on your videos to help keep me updated on what's going on.

[omerkaya]

My condolences to the passing of Mr. Stacking, I personally warned him of the these Glass Panels.

[AsbestosMuffins]

almost seems like a return to the 1980s silicon on saphire tech

[rollinwithunclepete]

I am kept on the leading edge with Asianomtry videos! Thanks, Jon!

[BertLensch]

When you started talking about organic warping due to heat it reminded me of some of the research that was being done at Georgia Tech's Package Research Center when I was providing IT support there in the early 2000's. And then low and behold you mentioned them and the research they have been doing since I left in 2008. I think if Corning and chip manufacturers can master the glass substrate it will be a benefit to not just being able to package chips more efficiently, but also help make glass stronger. I know Corning's Gorilla Glass has some of the best tinsel strength out there, but I would think they would be able to evolve it to be even stronger than it currently is to be able to stand up to the cutting and drilling of the panels for use as a die.

[catsspat]

背 (se : back; spine)
割れ (wa re : crack, broken piece)

[cva]

Corning Glass Museum in Corning NY is pretty cool. If you're ever near Corning (or Cornell or Ithaca) it's worth a trip. GLW is pretty special company that's managed to stay at the forefront.

[lukeeisenbraun]

Katherine Bourzac has a writeup in the October 2024 issue of IEEE Spectrum (pg 8) that describes how a team in Switzerland is using x-rays (PyXL) to image 3D chips down to 4nm resolution. This could give new life to 3D design testing that is very difficult to do right now as this excellent video describes. Glass recipes are highly guarded trade secrets to whom the spoils go.

[Keiseru]

I love how fast chip technology is being pushed right now. It's scary how high the barrier of entry is though. If there's any area where subsidies of more companies is actually a good idea its in fab technology. We can't just rely on a couple of companies or technology development will eventually stall.

[Csupenner]

Very nice coverage of advanced packaging! One possibility of through glass vias is laser induced deep etching (LIDE), a really cool technique where quartz is first modified by a laser and afterwards etched away. Seems to produce some strain-free and very steep vias.

[michaelmoorrees]

Kinda new, but reminds me of an older chip/display tech. Think of the active matrix LCD display. There they grow the driver circuitry directly the glass. TFT, or thin film transistors, located close to, and individually driving each pixel, making the pixel speed much faster. A Japanese company, just for fun and yucks, built a Z80 uC right on the glass, but it was large. About 2 inches by 2 inches (50x50mm). This was in the 1990s.

[joshieecs]

the corning achievement of packaging tech

[yxyk-fr]

13:47 we have TGVs in France, they are pretty fast ;-)

[Indrid__Cold]

Fascinating the way repurposing an older technology can suddenly restore or even enhance its relevance. Glass substrates certainly look compelling from a stability and material compatibility perspective. If I were looking at a fascinating career possibility, I think material science would be a compelling option. The way we make "stuff" and the new and varied ways we can use it just seem to be on the verge of a Renaissance. At 66, I'm too old to embark on such a career, but I'm enthusiastic about the opportunities it offers curious young minds. Anyway, thanks for the relevant and informative content.

[fnordist]

Yes, it's about time they start using glass panels; especially since heat transfer is much more efficient.

[LS-mglz]

It would be really cool to see a video about thermal paste / pads that are used on high performance chips. I love your work, and look forward to all of your videos!

[peterweller]

I love your blog it is a bit overwhelming of corse, but like Bob Ross, a classic.

[muskepticsometimes]

about 15 years ago I saw excellent presentation by Georgia Tech prof on glass for packaging. it was more to replace PCBs
1) much better dimensional stability than pcb
2) fairly low cost
3) leverage high volume roll-to-roll glass production for flat panel
4) flatter, takes hotter temperature
5) Thermal expansion closer to that of Silicon
6) cheaper than Is
7) glass roll-2-roll you can get huge areas - see flat screen TVs

[TheBlackBuddha]

I look forward to these videos every day. I love the asianometry youtube channel!!! Keep up the amazing work Jon!!