How to solder SOIC package of SMD chips?

A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package.
Integrated circuits are put into protective packages to allow easy handling and assembly onto ... Thin small-outline package (TSOP): thinner than SOIC with smaller pin spacing of 0.5 mm.