SmartPlate System | Fully-Sealed, Chassis-Level, Direct-to-Chip Liquid Cooling for Data Centers

Introducing JetCool's SmartPlate System. This MIL-SPEC tested, chassis-level, direct-to-chip liquid cooling solution has been popular with customers because of its flexibility to provide liquid cooling efficiency in an air-cooled form factor.

Its ability to cool up to 800W in a 1U and 1,200W in a 2U server configuration - no facility infrastructure required – is helpful for customers looking for performance without relying on CDUs or facility water hook-ups.

SmartPlate Systems are the most effective way to cool devices, whether in a data center, on-prem, or at the edge. With our fully sealed plug-and-play system, customers extend the useful lifetime of their servers and stay competitive by implementing compute-intensive AI/ML applications or clusters – all without modifications to existing infrastructure. Capture all the benefits of liquid cooling with no facility modifications (no plumbing!) required.

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