Armando Acosta, Dell Technologies | SC24

Armando Acosta, director of HPC product management at Dell Technologies, talks with theCUBE Research’s Dave Vellante and Savannah Peterson during SC24 about the essential role of direct liquid cooling in exascale computing. As computational capabilities expand, managing the resulting heat becomes critical to maintaining performance, most notably as organizations push the boundaries of processing power to tackle increasingly complex tasks, according to Acosta.


Direct liquid cooling technologies are vital for optimizing the efficiency of powerful central processing units and graphics processing units in high-performance computing, Acosta noted. This method addresses the growing thermal challenges and allows for greater performance in exascale systems. The introduction of modular designs, such as Dell’s OCP OVR3 rack, enhances serviceability while supporting silicon diversity, streamlining deployment and reducing costs across various workloads, ultimately enabling organizations to better adapt to evolving technological demands.




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