filmov
tv
Solder balls forming under chip capacitor due to excessive paste - Surface Mount Process
Показать описание
PLEASE LIKE AND SUBSCRIBE TO SUPPORT THE CHANNEL :)
Solder balls forming under chip capacitor due to excessive paste - Surface Mount Process
Mid chip solder ball or bead forming under SMT resistor during reflow soldering
Reflow of Chip Component
Solder balls forming under chip capacitor due to excessive paste #shorts
Most common defects (tombstone and solder Ball) during SMT soldering process in reflow oven.
Mid chip solder ball forming under resistor during reflow solder #shorts
DPAK soldering and formation of solder ball due to too much paste - Surface Mount Process
#shorts GDDR6X Solder balls attach
Reflow SMD Components With Hot Plate
SOLDER BALL ATTACH - KAM7000F
BGA planting ball chip, printing solder paste Drop the tin beads. It's that simple in 2023
Making of a Solder Ball on a DPAK
0.2mm diameter solder ball placement
Soldering balls
Reflow Soldering Defect - Chip capacitor tombstone #shorts
Solder Wetting of Surface Mount IC during Reflow Soldering
The Principle of Laser Solder Ball Welding
Hand soldering using solder paste and hot air tool #shorts
#SHORTS #SOLDER #BALL #TPYE0.60MM #MECHANIC #BOLITAS PARA #SOLDAR DE #MEDIDA DE 0.60MM #serviciotecn
Solder balls#metal #factory
10 solder paste printing process defects and solutions - under 3 mins!
Re-balling a chip using solder paste
Solder ball
BGA component reflow soldered to a PCB - solder balls melt and wet to pads.
Комментарии