2021 OCP Global Summit: Introduction of DC-SCM 2.0 LVDS Tunneling Protocol & Interface (LTPI)

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Speakers: Kasper Wszolek, Yi (Roy) Zeng (Intel)

One of the most significant change in the DC-SCM 2.0 specification is the introduction of Low-voltage differential signaling Tunneling Protocol & Interface (LTPI). It is a scalable and high bandwidth serial interface specially designed for the OCP DC-SCM use cases. It allows tunneling of multiple manageability interfaces between Host Platform Module and DC-SCM module over low pin count LVDS-based interface. The LTPI addresses shortcomings of Serial GPIO interface used in DC-SCM 1.0 by providing much lower latency for GPIO and a possibility to tunnel I2C, SMBus, UART, Data/Custom Channels. LTPI allowed for pinout optimizations and new capabilities addition in DC-SCM 2.0. In this presentation we will go through overview of the DC-SCM 2.0 LTPI specification and key concepts that were worked out by the DC-SCM 2.0 LTPI Workstream Group in 2021.
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