Packaging Part 5 - Manufacturing process

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References:
[3] Protected chip pic18f6525 heximal reading from its flash. (2019, June 26). Retrieved March 01, 2021
[5] Tsai, Jinn-Tsong & Chang, Cheng-Chung & Chen, Wen-Ping & Chou, Jyh-Horng. (2016). Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. IEEE Access. 4. 1-1. 10.1109/ACCESS.2016.2581258.
[15] Paquet, M., Dufort, C., Lombardi, T., Sinha, T., Hasegawa, M., Okoshi, K., & Kohara, K. (2016). Effect of Underfill Formulation on Large-Die, Flip-Chip Organic Package Reliability: A Systematic Study on Compositional and Assembly Process Variations. 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 729-736.
[17] C. Chien et al., "Performance and process characteristic of glass interposer with through-glass-via(TGV)," 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, 2013, pp. 1-7, doi: 10.1109/3DIC.2013.6702380.
[18] Saban, K. (2009). Xilinx Stacked Silicon Interconnect Technology Delivers Breakthrough FPGA Capacity , Bandwidth , and Power Efficiency.
[21] P. A. Thadesar, X. Gu, R. Alapati and M. S. Bakir, "Through-Silicon Vias: Drivers, Performance, and Innovations," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 7, pp. 1007-1017, July 2016, doi: 10.1109/TCPMT.2016.2524691.
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This is a terrific series of videos. You do an excellent job and have a very clear and broad overview. I have had some difficulty finding a effective way of getting this road view. Thank I am sure you know by
Know that the correct spelling is photolithography with the “th” pronounced as it is in “think”.

Redsson
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Hi Navid, thank you for making these videos and posting them on Youtube. As an intern at Intel, I find the packaging process very interesting and have plans to work for Intel one day. I have a mechanical engineering background and so I would like to ask whether one must have good electronics knowledge to start a career in packaging and testing? Also, is this series of lectures catered to EE students at the University of Florida? If so, which year if I may ask. Thank you and have a nice day!

iankhoojiaern
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Why not use interposer only and remove the substrate ?

spicyeddie
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Thanks for the clear overview. Any reason we can not just make the interconnection in the substrate without interposer?

tsengirv
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Good first start. I find the lectures quite useful. A long summary is not needed in this format. A quick one or two lines would do. Also, increasing the density would be ok. I can listen to HHP (link above) at 1.5x speed, down to 1.25x when I am not familiar with the material. I can do you at 1.75x without pause. (Speed control on academic lectures are great! It gives you all the time you need to do the thinking you need to teach, and I don't have wait.)

JeremyFBlack