Flexible Electronics: Side to Side Bend Testing

Mechanical Characterization/Reliability Testing of flexible electronics. This parallel plate, side to side bend test consists of a sample bent between two plates as the plates move side to side. Electrical resistance are monitored continuously. These samples consist of silver flake ink screen printed on Melinex (PET) substrates.

For more information see:
Rui Chen, Justin H. Chow, Christine Taylor, Jeff Meth, and Suresh K. Sitaraman. "Mechanical and Electrical Behavior of Printed Silver Conductor in Adaptive Curvature Flexure Test.", IEEE Transactions on Components, Packaging and Manufacturing Technology, conditionally accepted, 2019.