RF Noise Coupling -- Understanding, Mitigation and Impacts on Wireless Communication Performance

Abstract:
"Noise coupling in RF system-on-chip integration is studied by on-chip and on-board measurements as well as by concatenated simulations at chip and system levels. Integrated power and substrate noise simulation techniques use chip-package-system board combined circuit models and verify noise coupling in mixed analog-digital integration. Wireless system level simulation evaluates the impacts of coupled RF noises on wireless performance through metrics of throughput and error vector magnitude (EVM). In addition, post-silicon techniques at packaging and assembly stages are potential options to mitigate RF noise coupling problems. The presentation will also include demonstrations with test vehicles."

This presentation was recorded as part of the lecture "Selected Topics of Advanced Analog Chip Design" from the Institute of Electronics at TU Graz.

Special thanks to Prof. Makoto Nagata, for the insightful presentation.

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