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CFSensor product - Mems Pressure Sensor XGZP160
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XGZP160 is a surface mounting pressure sensor based on CFSensor silicon based piezoresistive pressure sensor die. The sensor die is bonded on a substrate with a plastic cap and packaged in a 6-pin SOP or DIP. The small size and high reliability of on-chip integration make this sensor a simple and economical choice for high volume application in a variety of industries. With standard SOP6 or DIP6 package, XGZP160 is easy for users to install by SMT or through hole board assembly.
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