S9-E1_Pragmatic FlexICs-Part 1-Introduction to Pragmatic's flexible integrated circuits

In this webinar, dr. Francesca Bottacchi from Pragmatic introduces Pragmatic’s flexible integrated circuit technology and its advantages over traditional Si technology. This webinar starts with a description of Pragmatic and its manufacturing facilities, including the lower carbon impact and energy requirements, which makes it a more sustainable choice, as well as the advantage of having a fast turnaround.
Pragmatic’s rapid cycle time takes designs from tape-out to delivery in around six weeks, empowering customers to drastically reduce product development time, perform early end-user testing, and accelerate time to market.
We then continue with a quick description of the key technical details. The second-generation Helvellyn 2.1.0 technology node offers four metal layers over a 600 nm minimum channel dimension n-type FET process. The process also includes a dedicated resistor layer and capacitors, it has an
operating voltage of 3 VDC, total thickness of 30 μm, and minimum bending radius of 5 mm.
Particularly suited to applications where form factor and cost outweigh speed and performance criteria, the Helvellyn technology is ideal for applications such as IoT, wearables, AR/VR, RFID, and sensing.

[amirbabfish]

hi,
where can we get some specs?
cap density
sheet resistance
threshold voltage
is flex to wafer bonding possible?