LY G750 G-750 auto align system BGA Rework Station for laptops & Game consoles 5200W blue version

LY G750 G-750 auto align system BGA Rework Station for laptops & Game consoles 220V 5200W blue version

Total power 5200 w
Upper heating power 1200W.
The lower heating power is 1200W.
Lower infrared heating power 2700W (1200W controlled)
Single Phase AC 220V plus or minus 1050hz.
Positioning mode V groove, the PCB bracket can be adjusted in any direction of X and Y, and the laser positioning lamp is quickly positioned.
Temperature control high precision k-type thermocouple (Ksensor) closed-loop control (Closed Loop), independent temperature measurement up and down.
The temperature accuracy can reach positive or negative 1 degree;
High sensitive touch screen + temperature control module +PLC+ step drive.
Maximum PCB size 410 x 380mm.
Minimum PCB size 10 x 10mm.
The number of temperature measuring interfaces is 3.
2-200 times the magnification of the chip.
PCB thickness 0.5 5 mm
Applicable chip 0.8mm-6cm.
The minimum spacing of the chip is 0.15mm.
The maximum load is 400G.
The mounting accuracy is 0.01mm.
Shape dimension L680 * W700 x H920mm.
The net weight of the machine is 68kg.

[sebastiencompagnone]

hello I have a problem with a machine that I bought from you.  it takes the action of removing the component when the temperature drops ... and therefore the solder and solid. can you tell me how to correct the problem?

Regards

[kiwiNL]

How much including shipping to the Netherlands?