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30 Years Fraunhofer IZM: #Wafer

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#Wafer
📀 Juliane Gocht is assistant site manager at Fraunhofer IZM-ASSID, our institute branch in Dresden. In the office at Fraunhofer IZM-ASSID, she is involved in all administrative areas such as purchasing, human resources, travel event/trade show planning, health care, incoming goods, invoice processing and much more - in other words, quite an extensive range of work. The site was opened in 2010 and is an integral part of Fraunhofer IZM's wafer-level system integration activities. The centerpiece is the 200-300 mm technology line for 3D wafer-level system integration based on copper-through-silicon-via (Cu-TSV) technology.
Fraunhofer IZM-ASSID's approximately 40 employees are constantly contributing to Fraunhofer IZM's advancement through their work and research, and as a result, have already won the prestigious 3D-InCites AWARD at Semicon West in San Francisco, USA.
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📀 Juliane Gocht is assistant site manager at Fraunhofer IZM-ASSID, our institute branch in Dresden. In the office at Fraunhofer IZM-ASSID, she is involved in all administrative areas such as purchasing, human resources, travel event/trade show planning, health care, incoming goods, invoice processing and much more - in other words, quite an extensive range of work. The site was opened in 2010 and is an integral part of Fraunhofer IZM's wafer-level system integration activities. The centerpiece is the 200-300 mm technology line for 3D wafer-level system integration based on copper-through-silicon-via (Cu-TSV) technology.
Fraunhofer IZM-ASSID's approximately 40 employees are constantly contributing to Fraunhofer IZM's advancement through their work and research, and as a result, have already won the prestigious 3D-InCites AWARD at Semicon West in San Francisco, USA.
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