Professional Hand Soldering Training - Surface Mount Technology, DPAK

By John Gammel, MIT (Master IPC Trainer). Circuit Technology Inc.

[nidiaosorio]

According with IPC class 3, "Surface mounted device leads or components shall not [ D1D2D3] be pressed down against the printed board land or other mating surface during the soldering operation or during solder solidification"

[maazahmad]

I need the name of all equipments which you are using

[naveedriyaz]

ye aap ne kon kon sa ..solder gun use kiya hy..plees ....batawo... plees

[MisterXS]

3 different tips for 1 single dpak ... yep if you're in class it's ok but in real situations would take too long