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IMAPS Symposium on Microelectronics 2023
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IMAPS largest annual conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly
• 5-track program with over 100 speakers and poster presentations
• Keynotes from IBM Research, ASE, TSMC and Qorvo
• Panel sessions with interactive discussion
• Exhibit hall featuring 90+ booths
• 16 two-hour Professional Development Courses
The technical content will cover topics related to SiP/Design/Manufacturing Optimization; Wafer Level/Panel Level (Advanced RDL); High Performance/High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technologies).
• 5-track program with over 100 speakers and poster presentations
• Keynotes from IBM Research, ASE, TSMC and Qorvo
• Panel sessions with interactive discussion
• Exhibit hall featuring 90+ booths
• 16 two-hour Professional Development Courses
The technical content will cover topics related to SiP/Design/Manufacturing Optimization; Wafer Level/Panel Level (Advanced RDL); High Performance/High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technologies).
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