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ECOC 2022: SENKO update with Peter Gordon on CudoForm Technology
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SENKO Advanced Components
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0:01:36
ECOC 2022: SENKO update with Peter Gordon on CudoForm Technology
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ECOC Exhibition 2022 - Dr Bernard Lee, Director Technology & Innovation, Senko
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Paul Yip of Optec explains the COBO Booth demos at ECOC 2022
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Ichiro Ogura of AIO Core discusses their Silicon Photonics Micro IC + Immersion Cooling at ECOC 2022
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SENKO Components Showcases the Future of Photonics Integration with The SN Connector
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ECOC Exhibition 2022
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ECOC Exhibition 2022 - Market Focus - Thomas Hessler, CEO, Ligentec
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ECOC Exhibition 2022 - Dr Sanjai Parthasarathi, Chief Marketing Officer, Coherent
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OIF ECOC 2022 Multivendor Interoperability Demo Highlights
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Senko Advances Interconnectivity
0:12:49
Tiger Ninomiya gives a tour of the COBO ECOC 2022 Stand in Basel, Switzerland
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SENKO ADVANCED COMPONENTS - New Fibre Optic connectivity for OBO/CPO application PHOTONICS+ 2021
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Connectors for the Terabit Era
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New Fiber Connectivity Options Inside the Switch Chassis
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OIF Interop Demo at OFC 2022
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How to Plug and Unplug Fiber Optic Connectors
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What's hot at OFC22? Co-Packaged Optics
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Peter Wang of AOI on 800G, 1.6T modules, Co-Packaged Optics and external light source products
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ECOC Exhibition 2021 Highlights
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US Conec on Optical Interconnects
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ECOC22: Optec's Fiber Shuffle for CPO switches
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ECOC22: Booth tour, Consortium for Onboard Optics
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Molex and COBO - Addressing the future of co-packaged optics
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Marvell's Josef Berger on Co-packaged optics and 400ZR
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