Oxford Instruments - PlasmaPro 80 Training

The Oxford RIE (Reactive-Ion Etcher) is an anisotropic dry etching system used in micro and nanofabrication. RIE uses a chemically reactive plasma to remove material from the surface of wafers or chips. The plasma is generated under a vacuum by an electromagnetic field and directed towards a substrate patterned with e-beam, photoresist, or a hard mask. High-energy ions from the plasma react with the material on the surface of the wafer or chip and form volatile compounds that desorb from the surface removing atoms of the target material.

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